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Spice Based Heat Transport Model for Non-Intrusive Thermal Diagnostic Applications
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Spice Based Heat Transport Model for Non-Intrusive Thermal Diagnostic Applications

This research text provides a detailed look at the equivalence between the thermal system of equations and the variables of circuit theory. This relationship is used together with SPICE (Simulation Program with Integrated Circuits Emphasis), to accurately model heat flow with traditional methods in electrical engineering. The book details the computational complexity of heat flow and why an electrical analogue to the thermal system improves the efficiency and computational speed of the solutions.

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Product Details:
Author: Michael Stelzer
Paperback: 160 pages
Publisher: BookSurge Publishing
Publication Date: August 17, 2005
ISBN: 1419606131
Package Length: 9.9 inches
Package Width: 6.8 inches
Package Height: 0.6 inches
Package Weight: 0.75 pounds
Average Customer Rating: based on 3 reviews
 
 

Customer Reviews:
Average Customer Review:5.0
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25 of 29 found the following review helpful:

5Further enhancements in thermal modeling  Nov 03, 2005
This book has further expanded upon the principals of thermal modeling, and SPICE modeling techniques. The models represent the physical model both analytically and structurally.

21 of 29 found the following review helpful:

5Excellent Material  Nov 02, 2005
This book introduced the concept of temperature dependant thermal conductivity which further improved upon the reliability of the Model.

28 of 29 found the following review helpful:

5Thermal dynamics effectively modeled by electrical equivalents  Oct 12, 2005
FISHKILL, NEW YORK - Booksurge announces the publication of SPICE Based
Heat Transport Model for Non-intrusive Thermal Diagnostic Applications, by Michael A. Stelzer, Ph.D.

Michael A. Stelzer, Ph.D., gives an impressively detailed look at the equivalence between the thermal system of equations and the variables of circuit theory. He uses this similarity, together with SPICE (Simulation Program with Integrated Circuits Emphasis), to accurately model heat flow with traditional methods in electrical engineering. Originally Dr. Stelzer's thesis, the book details the computational complexity of heat flow and why an electrical analogue to the thermal system improves the efficiency and computational speed of the solutions.

The work also successfully carries out the following tasks: (a) Demonstrates that clear differences exist in the results of simulated heat flow between pure samples and those containing defects and/or cracks. (b) Identifies the parameters that can best carry information on the defects. (Dr. Stelzer points out these are time-delays and magnitudes of the local temperature in response to a laser-generated heat span.) (c) Shows a test example of a SPICE-based method for irrefutable demonstration. Additionally, the research points out that an error of less than 5% exists between the SPICE results and those of an exact thermal solution. Packed with over 80 figures and tables, the book thoroughly verifies Dr. Stelzers' ideas and conclusions.
About the Author
Michael A. Stelzer, Ph.D., is a three time author, a champion competitor in martial arts, and a distinguished engineer. He received a doctorate in electrical engineering in June 2005. In addition to speaking several languages he is a U.S. Navy veteran. His other books include Mental Mathematics and Learn a Language Your Own Way.


 
 
 
 
 
 
 
 
 
 
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